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  • PCB Design FAQ

What are the best PCB layout practices for motor drivers and H-bridges?

Q: What are the best PCB layout practices for motor drivers and H-bridges? Answer Motor driver PCB layout is critical for thermal performance and EMI. Use a dedicated power plane for motor supply (VM). Place gate resistors (10-100 Ohm) within…

  • InnovChip
  • June 22, 2026
  • PCB Design FAQ

How to design a 4-layer PCB stack-up for optimal signal integrity and cost?

Q: How to design a 4-layer PCB stack-up for optimal signal integrity and cost? Answer Recommended 4-layer stack-up: Layer 1 (top): signals; Layer 2: GND plane; Layer 3: power plane; Layer 4 (bottom): signals. This provides 50 Ohm microstrip on…

  • InnovChip
  • June 22, 2026
  • PCB Design FAQ

What is the correct via-in-pad design for BGA and high-density PCB layouts?

Q: What is the correct via-in-pad design for BGA and high-density PCB layouts? Answer Via-in-pad (VIP) is essential for BGA escape routing: thermal vias non-conductive filled (epoxy fill) and capped or conductive fill. Thermal vias under BGA pads: 0.3-0.4 mm…

  • InnovChip
  • June 22, 2026
  • PCB Design FAQ

How to route high-speed signals through connectors and cables without signal degradation?

Q: How to route high-speed signals through connectors and cables without signal degradation? Answer At connectors maintain controlled impedance to within +-10%. Pinout: place ground pins adjacent to high-speed signal pairs. Use impedance-matched connectors. For FFC/FPC cables >5 cm at…

  • InnovChip
  • June 22, 2026
  • PCB Design FAQ

What are the panelization and fiducial mark requirements for PCB manufacturing?

Q: What are the panelization and fiducial mark requirements for PCB manufacturing? Answer Panelization: Use V-groove scoring for boards 0.5 mm pitch: two crosses per BGA area on opposite corners. Fiducial size: 1 mm outer pad 0.5 mm inner clear.…

  • InnovChip
  • June 22, 2026
  • PCB Design FAQ

What thermal management techniques should be used for high-power PCB components?

Q: What thermal management techniques should be used for high-power PCB components? Answer For power components: (1) Maximize copper area on the pad and surrounding ground pour. Use thermal vias (0.3-0.5 mm diameter 1 mm pitch) to connect top layer…

  • InnovChip
  • June 22, 2026
  • PCB Design FAQ

How to reduce EMI emissions from PCB switching power supply circuits?

Q: How to reduce EMI emissions from PCB switching power supply circuits? Answer EMI from switching supplies comes from: (1) Switching transients at the MOSFET/diode node (2) discontinuous input current (3) ground noise. Countermeasures: slow down the switching edge with…

  • InnovChip
  • June 22, 2026
  • PCB Design FAQ

What are the decoupling capacitor placement best practices for high-speed MCUs?

Q: What are the decoupling capacitor placement best practices for high-speed MCUs? Answer Place decoupling capacitors as close as physically possible to the power pins:

  • InnovChip
  • June 22, 2026
  • PCB Design FAQ

How to design a proper ground plane and manage return paths in PCB layout?

Q: How to design a proper ground plane and manage return paths in PCB layout? Answer A solid ground plane is the single most important factor for PCB signal integrity. Keep the ground plane continuous under all signal traces. For…

  • InnovChip
  • June 22, 2026
  • PCB Design FAQ

What is the correct way to route differential pairs for USB HDMI and Ethernet?

Q: What is the correct way to route differential pairs for USB HDMI and Ethernet? Answer Maintain consistent differential impedance throughout: 90 Ohm +-10% for USB 2.0 100 Ohm +-10% for Ethernet. Keep intra-pair length mismatch < 0.25 mm for…

  • InnovChip
  • June 22, 2026
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