ODM Services — Original Design Manufacturing
We design, engineer, and manufacture your product under your brand. Full-stack ODM — from concept to mass production, with complete IP transfer and long-term supply chain management.
Why Choose Our ODM Service
Your Brand, Our Engineering
You own the brand identity, market channel, and end-customer relationship. We own the engineering — hardware, firmware, enclosure, certification, and manufacturing.
Full IP Transparency
Unlike many ODMs, we transfer all design IP — schematics, PCB files, firmware source code, BOM, mechanical CAD, and test fixtures. You are never locked in.
Certification Included
We manage the entire certification process — CE (RED/EMC/LVD), FCC Part 15, UKCA, and RoHS/REACH compliance. Pre-compliance testing during development reduces risk.
Supply Chain Ownership
We manage component sourcing, alternate qualification, EOL monitoring, and inventory buffer strategy — so your production line never stops due to a missing part.
The ODM Engagement Model
Original Design Manufacturing is the most comprehensive service we offer. It is the ideal engagement model for companies that want to launch a branded electronic product but lack in-house hardware engineering capability or prefer to focus on sales, marketing, and customer relationships while a trusted partner handles the technical heavy lifting. Our ODM model is built on three foundational principles: radical transparency (you receive every design file and document), cost predictability (fixed NRE + agreed unit pricing with volume tiers), and no vendor lock-in (you own the IP and can manufacture anywhere after the initial engagement).
A typical ODM engagement progresses through five phases. Phase 1: Product Definition — we work with your team to define the product specification, target BOM cost, volume projections, certification requirements, and timeline. This phase produces a Product Requirements Document (PRD) that serves as the shared reference for all subsequent work. Phase 2: Engineering Development — our multidisciplinary team executes hardware design (schematic + PCB), firmware development, enclosure design (industrial design + mechanical engineering), and packaging design. We deliver a functional prototype (EVT — Engineering Validation Test) for your review and feedback, typically within 8-12 weeks.
Phase 3: Design Validation and Certification — we build a DVT (Design Validation Test) batch of 20-50 units that are mechanically, electrically, and functionally representative of the final product. These units undergo a rigorous test plan: thermal cycling (-20°C to +70°C for commercial products), vibration testing per IEC 60068, EMC pre-compliance scanning, drop testing, ingress protection verification (IP rating), and full functional regression. In parallel, we submit samples to accredited test labs for formal certification: CE (EMC Directive 2014/30/EU, RED Directive 2014/53/EU if wireless, LVD 2014/35/EU), FCC Part 15 (radiated and conducted emissions), and RoHS/REACH material compliance.
Phase 4: Pilot Production — we manufacture a PVT (Production Validation Test) batch of 100-500 units on the actual production line, with the actual production BOM, assembly processes, and test fixtures. This phase validates that the manufacturing process is stable (Cpk > 1.33 for critical parameters), yield targets are met (>98%), and the supply chain can support ramp-up to full volume. Phase 5: Mass Production and Sustaining — we transition to ongoing production with weekly or monthly build schedules, continuous quality monitoring (yield reports, field failure analysis, 8D corrective action reports), and engineering change management (ECO process for component substitutions, cost reductions, or feature enhancements).
Quality Management and Continuous Improvement
Our ODM quality system is built on ISO 9001 principles with additional rigor for electronic products. Every production batch undergoes incoming quality control (IQC) — sampling inspection of incoming components per ANSI/ASQ Z1.4 (AQL 0.65 for critical, 1.0 for major, 2.5 for minor defects), including visual inspection, dimensional measurement, and electrical testing of active components. In-process quality control (IPQC) includes solder paste inspection (SPI) after printing, automated optical inspection (AOI) after SMT placement, X-ray inspection for BGA/QFN solder joints, and functional testing of every assembled PCB before final assembly. Outgoing quality control (OQC) performs full functional test, visual inspection, and packaging verification on a statistical sample before shipment.
We also implement a continuous improvement feedback loop: field failure data is analyzed monthly, root causes are identified through 8D methodology, corrective actions are implemented, and effectiveness is verified over the following 3-6 months. This closed-loop process has driven our field failure rate below 0.5% across our ODM product portfolio.
Technologies We Master
Firmware Development
Enclosure Design
CE / FCC / UKCA
RoHS / REACH
SMT / THT Assembly
BOM Cost Optimization
Supply Chain Mgmt
ISO 9001 / IPC-A-610
AOI / X-Ray Inspection
ECO / 8D Process
Packaging Design
Launch Your Product with Confidence
Tell us about your product vision. We provide a complete ODM proposal — NRE estimate, unit pricing, development timeline, and certification plan — within one week.