Professional PCB Design & Manufacturing Solutions

At InnovChip Electronics, we deliver end-to-end PCB design services that transform your electronic concepts into production-ready hardware. With over 10 years of experience in multi-layer PCB design, high-speed signal integrity, and industrial-grade manufacturing, we help companies reduce time-to-market while ensuring the highest quality standards.

Whether you need a simple 2-layer prototype or a complex 12-layer industrial controller board, our engineering team has the expertise to deliver optimized designs that meet your performance, cost, and reliability requirements.

Our PCB Design Capabilities

Multi-Layer PCB Design

  • 2-12 layer boards for various applications
  • High-density interconnect (HDI) designs
  • Blind and buried vias implementation
  • Controlled impedance routing for high-speed signals

High-Speed & RF Design

  • Signal integrity analysis
  • DDR3/DDR4 memory interface design
  • Ethernet and USB high-speed routing
  • RF circuit design up to 6GHz

Industrial & Automotive Grade

  • IEC 61000 EMC compliance design
  • Automotive-grade PCB (AEC-Q200)
  • High-temperature applications (up to 150°C)
  • Conformal coating specifications

Power Electronics

  • DC-DC converter layouts
  • Motor driver circuits
  • High-current trace design (up to 50A)
  • Thermal management solutions

Our PCB Design Process

Phase 1: Requirements Analysis (2-3 days)

  • Review schematic and design specifications
  • Define layer stackup and material requirements
  • Establish design rules and constraints
  • Create project timeline and milestones

Deliverables: Design requirements document, Layer stackup proposal, Project schedule

Phase 2: Component Placement (3-5 days)

  • Critical component placement for optimal performance
  • Thermal analysis and heat sink positioning
  • Mechanical constraint verification
  • Design for manufacturability (DFM) review

Deliverables: Component placement report, Thermal analysis results, 3D mechanical verification

Phase 3: Routing & Optimization (5-10 days)

  • High-speed signal routing with length matching
  • Power and ground plane design
  • EMI/EMC optimization
  • Design rule checking (DRC)

Deliverables: Routed PCB layout, Signal integrity report, DRC clearance report

Phase 4: Manufacturing Files (2-3 days)

  • Gerber file generation
  • Drill files and fabrication drawings
  • Assembly drawings and BOM optimization
  • Test point and programming interface definition

Deliverables: Complete manufacturing package, Assembly instructions, Testing guidelines

Get Started Today

Ready to bring your electronic design to life? Contact us now for a free consultation!

📧 Email: cedar@innovchip.net